Given its reliability, simplicity, and efficiency, such device can possibly be used for heat dissipation of multichip in closed space in the future. The practical value of the self-driven liquid metal cooling device is rather evident. With two chips working simultaneously, both chips had close temperature and hot spot did not appear easily when subject to large power, which will help reduce thermal stress and enhance reliability of the system. The cooling performance of the device could achieve better when the angle between the cabinet and the horizontal plane varied from 0 ☌ to 90 ☌. It was shown that for the one chip case, the cooling device could maintain the chip temperature to below 85.1 ☌ at the ambient temperature 20 ☌ when the heat load was about 122 W. Experiments were performed when two simulated hot chips in the closed cabinet worked at different heat loads and different angles with the horizontal plane. A model prototype was then fabricated and tested. The principles, especially the theory for convective thermal resistance of liquid metal cooling was provided for guiding optimization of the device. In this study, a practical design and implementation of a buoyancy effect driven liquid metal cooling device for the automatic thermal management of hot chips in a closed cabinet were demonstrated. The liquid metal cooling has recently been validated as a highly effective method to dissipate heat from hot chips. Permatex 25909 Liquid Metal Filler, 3.5 oz. Tremendous attentions have been focused on thermal management to control the temperature of many advanced integrated electronic devices. Thermal Grizzly Conductonaut Thermal Grease - 1 Gram Set + 3X Extra Applicators - Liquid Metal Thermal Paste for Cooling The CPU, GPU 604 2299 FREE delivery on 25 shipped by Amazon. Journal of Verification, Validation and Uncertainty Quantification.Journal of Thermal Science and Engineering Applications.Journal of Offshore Mechanics and Arctic Engineering.Journal of Nuclear Engineering and Radiation Science. ![]() Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems.Journal of Nanotechnology in Engineering and Medicine.Journal of Micro and Nano-Manufacturing.Journal of Manufacturing Science and Engineering.Journal of Engineering Materials and Technology.Journal of Engineering for Sustainable Buildings and Cities.Journal of Engineering for Gas Turbines and Power.Journal of Engineering and Science in Medical Diagnostics and Therapy.Journal of Electrochemical Energy Conversion and Storage.Journal of Dynamic Systems, Measurement, and Control.Journal of Computing and Information Science in Engineering.Journal of Computational and Nonlinear Dynamics.Journal of Autonomous Vehicles and Systems.ASME Letters in Dynamic Systems and Control. ![]()
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |